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14 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
729
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 52POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 52 (2 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,722
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
1,866
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
920
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
2,226
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
3,064
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
3,845
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
908
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | ||||
VIEW |
2,799
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
3,169
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
2,886
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
995
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
2,222
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass | ||||
VIEW |
2,064
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 52POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 52 (2 x 26) | Beryllium Copper | - | Brass |