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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	16-3508-302	RFQ VIEW	PDF RFQ	3,412 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-3508-202	RFQ VIEW	PDF RFQ	2,501 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	215-1-16-003	RFQ VIEW	PDF RFQ	1,317 In-stock	CNC Tech	CONN IC DIP SOCKET 16POS GOLD		-	Active	Tube	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-3508-30	RFQ VIEW	PDF RFQ	1,969 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-3508-20	RFQ VIEW	PDF RFQ	3,906 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-3508-301	RFQ VIEW	PDF RFQ	2,322 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-3508-201	RFQ VIEW	PDF RFQ	1,931 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-C280-30	RFQ VIEW	PDF RFQ	3,595 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-C280-20	RFQ VIEW	PDF RFQ	3,149 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-C195-30	RFQ VIEW	PDF RFQ	1,712 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-C195-20	RFQ VIEW	PDF RFQ	2,063 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-1508-30	RFQ VIEW	PDF RFQ	2,734 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass
	16-1508-20	RFQ VIEW	PDF RFQ	1,419 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)	Brass

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