Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
D2928-42
RFQ
VIEW
RFQ
788
In-stock
Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash 28 (2 x 14) Beryllium Copper Brass
D95028-42
RFQ
VIEW
RFQ
1,809
In-stock
Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 28 (2 x 14) Beryllium Copper Brass
D2828-42
RFQ
VIEW
RFQ
3,129
In-stock
Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash 28 (2 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,552
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) 28 (2 x 14) Beryllium Copper Brass