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16 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,483
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
751
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 48POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 48 (2 x 24) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,489
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | - | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,930
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 42POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 42 (2 x 21) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
616
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 48POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 48 (2 x 24) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,155
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 40POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 40 (2 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,251
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 32POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,809
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 28POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 28 (2 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,787
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,716
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
651
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,272
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 32POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,748
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,129
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 28POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 28 (2 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,552
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 28 (2 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,960
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 64POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
