Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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3,876
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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952
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,407
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,015
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,915
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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863
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
14-820-90T
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760
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,403
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Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,190
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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2,955
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,894
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,497
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,329
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,103
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,969
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,776
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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2,658
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,553
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
918
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,120
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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1,752
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,645
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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3,113
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
2,847
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,825
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,518
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,731
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
2,611
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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RFQ
1,845
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
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2,666
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze