Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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626
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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1,078
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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601
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,526
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,472
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,278
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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1,481
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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821
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,178
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,812
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,434
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,282
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass