Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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2,441
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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809
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Aries Electronics CONN SOCKET SIP 17POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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1,310
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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3,524
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Aries Electronics CONN SOCKET SIP 17POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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1,734
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Aries Electronics CONN SOCKET SIP 17POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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779
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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2,260
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Aries Electronics CONN SOCKET SIP 17POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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2,829
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Aries Electronics CONN SOCKET SIP 17POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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657
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Aries Electronics CONN SOCKET SIP 17POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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3,222
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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3,919
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass