Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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3,685
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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1,248
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-115-41-013000
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 15POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy