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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
GLOBAL STOCKS
	20-6621-30	RFQ VIEW	PDF RFQ	1,078 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS TIN		6621	Active	Bulk	-55°C ~ 105°C	Through Hole, Bottom Entry; Through Board	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	20 (2 x 10)	Phosphor Bronze	Phosphor Bronze
	20-823-90C	RFQ VIEW	PDF RFQ	3,661 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-822-90C	RFQ VIEW	PDF RFQ	2,460 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-6503-30	RFQ VIEW	PDF RFQ	848 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-6503-20	RFQ VIEW	PDF RFQ	2,606 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-3503-30	RFQ VIEW	PDF RFQ	2,195 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-3503-20	RFQ VIEW	PDF RFQ	3,246 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-1508-30	RFQ VIEW	PDF RFQ	2,620 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-1508-20	RFQ VIEW	PDF RFQ	3,104 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3511-10	RFQ VIEW	PDF RFQ	2,225 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS TIN		511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	20 (2 x 10)	Phosphor Bronze	Phosphor Bronze
	20-6823-90C	RFQ VIEW	PDF RFQ	2,568 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-6822-90C	RFQ VIEW	PDF RFQ	2,146 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-6820-90C	RFQ VIEW	PDF RFQ	1,711 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-9503-30	RFQ VIEW	PDF RFQ	1,820 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-9503-20	RFQ VIEW	PDF RFQ	1,905 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-820-90C	RFQ VIEW	PDF RFQ	3,254 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-6511-10	RFQ VIEW	PDF RFQ	3,442 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS TIN		511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	20 (2 x 10)	Phosphor Bronze	Phosphor Bronze

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