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46 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
2,141
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,460
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,020
In-stock
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Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,105
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,451
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,461
In-stock
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Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,879
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,223
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,821
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,821
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 34 (2 x 17) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,023
In-stock
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,393
In-stock
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,185
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,619
In-stock
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,961
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,934
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,867
In-stock
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Aries Electronics | CONN IC DIP SOCKET 32POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,169
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,681
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,967
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 38 (2 x 19) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,225
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,582
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,522
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,755
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,945
In-stock
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Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,509
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
687
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
641
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,851
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,973
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
