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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	12-1508-30	RFQ VIEW	PDF RFQ	2,401 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-1508-20	RFQ VIEW	PDF RFQ	1,675 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-3503-30	RFQ VIEW	PDF RFQ	1,901 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	12-3503-20	RFQ VIEW	PDF RFQ	998 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	12-6503-30	RFQ VIEW	PDF RFQ	647 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	12-6503-20	RFQ VIEW	PDF RFQ	741 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze

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