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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	10-6501-20	RFQ VIEW	PDF RFQ	1,188 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS TIN		501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Tin	10 (2 x 5)	Phosphor Bronze	200.0µin (5.08µm)	Phosphor Bronze
	10-28440-10	RFQ VIEW	PDF RFQ	2,107 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS TIN		8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Tin	10 (2 x 5)	Phosphor Bronze	200.0µin (5.08µm)	Phosphor Bronze
	10-9503-30	RFQ VIEW	PDF RFQ	774 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-9503-20	RFQ VIEW	PDF RFQ	885 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-6503-30	RFQ VIEW	PDF RFQ	3,857 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-6503-20	RFQ VIEW	PDF RFQ	1,178 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-3503-30	RFQ VIEW	PDF RFQ	928 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-3503-20	RFQ VIEW	PDF RFQ	3,316 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-2503-30	RFQ VIEW	PDF RFQ	840 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-2503-20	RFQ VIEW	PDF RFQ	2,298 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	10-2501-20	RFQ VIEW	PDF RFQ	1,877 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS TIN		501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Tin	10 (2 x 5)	Phosphor Bronze	200.0µin (5.08µm)	Phosphor Bronze
	10-1508-30	RFQ VIEW	PDF RFQ	1,822 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-1508-20	RFQ VIEW	PDF RFQ	875 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass

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