Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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3,984
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper Brass
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1,972
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper Brass
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3,829
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,710
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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3,757
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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3,380
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper Brass
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3,351
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper Brass
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3,576
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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1,890
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Phosphor Bronze
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1,511
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Phosphor Bronze
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2,169
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Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper Brass
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1,681
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Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper Brass
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1,261
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Phosphor Bronze
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1,707
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Phosphor Bronze
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3,190
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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2,955
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,894
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,497
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,329
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,103
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,969
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,776
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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2,658
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,553
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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918
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,120
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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1,752
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,645
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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3,113
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze
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2,847
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Aries Electronics CONN IC DIP SOCKET 14POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze Phosphor Bronze