Contact Finish Thickness - Mating :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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750
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,685
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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650
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,348
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 326 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
714-93-132-31-018000
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2,991
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,416
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Mill-Max Manufacturing Corp. CONN SOCKET PGA 132POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 132 (14 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,434
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Mill-Max Manufacturing Corp. CONN SOCKET PGA 391POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 391 (18 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,152
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 323 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,769
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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986
In-stock
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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2,424
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,963
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,346
In-stock
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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1,785
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,472
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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747
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,046
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,782
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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703
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,817
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Mill-Max Manufacturing Corp. CONN SOCKET PGA 132POS GOLD 522 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 132 (14 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-99-164-41-013000
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RFQ
3,939
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS TIN-LEAD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,844
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-153-41-013000
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RFQ
1,982
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 53POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 53 (1 x 53) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-152-41-013000
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RFQ
1,679
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 52POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (1 x 52) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-151-41-013000
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RFQ
2,437
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 51POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 51 (1 x 51) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-150-41-013000
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RFQ
2,851
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 50POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (1 x 50) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-149-41-013000
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RFQ
1,087
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 49POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 49 (1 x 49) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-148-41-013000
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RFQ
2,517
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 48POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (1 x 48) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-136-41-013000
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RFQ
833
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 36POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-135-41-013000
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RFQ
734
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 35POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass Alloy