Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
714-43-256-31-018000
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1,097
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 56 (2 x 28) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
117-93-656-41-005000
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3,572
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 56 (2 x 28) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-656-41-005000
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2,949
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 56 (2 x 28) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,123
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold Flash Tin 56 (2 x 28) Beryllium Copper 200.0µin (5.08µm) Brass Alloy