Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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796
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Aries Electronics CONN SOCKET SIP 15POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,107
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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2,190
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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3,767
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Aries Electronics CONN SOCKET SIP 15POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,741
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Aries Electronics CONN SOCKET SIP 15POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,996
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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2,190
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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1,464
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Aries Electronics CONN SOCKET SIP 15POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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1,290
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Aries Electronics CONN SOCKET SIP 15POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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1,379
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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1,486
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Aries Electronics CONN SOCKET SIP 15POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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2,406
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Aries Electronics CONN SOCKET SIP 15POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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3,839
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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3,584
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,723
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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2,656
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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741
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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615
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Aries Electronics CONN SOCKET SIP 15POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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975
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper