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4 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||
VIEW |
3,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 64 (2 x 32) | Beryllium Copper | Phosphor Bronze | ||||
VIEW |
3,867
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 64 (2 x 32) | Beryllium Copper | Phosphor Bronze | ||||
VIEW |
2,420
In-stock
|
3M | CONN IC DIP SOCKET ZIF 64POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | Beryllium Copper | ||||
VIEW |
2,797
In-stock
|
3M | CONN IC DIP SOCKET ZIF 64POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | Beryllium Copper |