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5 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Mounting Type | Termination | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,545
In-stock
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Aries Electronics | CONN SOCKET SIP 1POS GOLD | 0503 | Active | Bulk | Through Hole | Wire Wrap | SIP | Polyamide (PA), Nylon, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 1 (1 x 1) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
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VIEW |
3,326
In-stock
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Aries Electronics | CONN SOCKET SIP 1POS GOLD | 0503 | Active | Bulk | Through Hole | Wire Wrap | SIP | Polyamide (PA), Nylon, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 1 (1 x 1) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
701
In-stock
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Aries Electronics | CONN SOCKET SIP 1POS GOLD | 0517 | Active | Bulk | Through Hole, Right Angle | Solder | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 1 (1 x 1) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,489
In-stock
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Aries Electronics | CONN SOCKET SIP 1POS GOLD | 0503 | Active | Bulk | Through Hole | Wire Wrap | SIP | Polyamide (PA), Nylon, Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 1 (1 x 1) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
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|
VIEW |
1,504
In-stock
|
Aries Electronics | CONN SOCKET SIP 1POS GOLD | 0503 | Active | Bulk | Through Hole | Wire Wrap | SIP | Polyamide (PA), Nylon, Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 1 (1 x 1) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
