Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,522
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Aries Electronics CONN SOCKET SIP 25POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,320
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Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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1,109
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Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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2,227
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Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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1,136
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Aries Electronics CONN SOCKET SIP 25POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
714-43-125-31-018000
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1,592
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 25POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 25 (1 x 25) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,384
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Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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1,880
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Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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909
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Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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2,899
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Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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1,721
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Aries Electronics CONN SOCKET SIP 25POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
25-0501-30
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1,112
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Aries Electronics CONN SOCKET SIP 25POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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763
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Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-125-41-013000
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2,651
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 25POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
25-0503-30
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1,923
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Aries Electronics CONN SOCKET SIP 25POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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1,390
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Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-125-41-013000
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797
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 25POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,437
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Aries Electronics CONN SOCKET SIP 25POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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814
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Aries Electronics CONN SOCKET SIP 25POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,966
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Aries Electronics CONN SOCKET SIP 25POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,865
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Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 25 (1 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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700
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,803
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,987
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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824
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,222
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,282
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,017
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,982
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,094
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Aries Electronics CONN SOCKET SIP 25POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 25 (1 x 25) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze