Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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714-43-112-31-018000
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693
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (1 x 12) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,370
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Aries Electronics CONN SOCKET SIP 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,794
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Aries Electronics CONN SOCKET SIP 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,730
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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3,564
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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1,985
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Phosphor Bronze - Phosphor Bronze
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1,520
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 12 (1 x 12) Beryllium Copper - Beryllium Copper
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687
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,243
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,981
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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1,172
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,899
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,933
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,894
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,259
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,036
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,038
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Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,998
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Aries Electronics CONN SOCKET SIP 12POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,812
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Aries Electronics CONN SOCKET SIP 12POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
12-0511-10
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1,977
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Aries Electronics CONN SOCKET SIP 12POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 12 (1 x 12) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,470
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-112-41-013000
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3,922
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,886
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 12 (1 x 12) Beryllium Copper 20.0µin (0.51µm) Copper
346-93-112-41-013000
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1,680
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,430
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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2,840
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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829
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,542
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Aries Electronics CONN SOCKET SIP 12POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,235
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 316 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,937
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Aries Electronics CONN SOCKET SIP 12POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass