Packaging :
Contact Finish - Mating :
Contact Material - Mating :
Contact Finish Thickness - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,130
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Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper - Brass
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2,340
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Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper - Brass
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1,558
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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RFQ
2,782
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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RFQ
3,662
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Brass
Default Photo
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RFQ
2,377
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper - Brass
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RFQ
1,049
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
ICA-308-SGT
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1,996
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
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882
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper - Brass
4808-3000-CP
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RFQ
3,923
In-stock
3M CONN IC DIP SOCKET 8POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 8 (2 x 4) Phosphor Bronze 35.0µin (0.90µm) Phosphor Bronze
4808-3004-CP
RFQ
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RFQ
2,351
In-stock
3M CONN IC DIP SOCKET 8POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 8 (2 x 4) Phosphor Bronze 35.0µin (0.90µm) Phosphor Bronze