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- Series :
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- - (1538)
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- Termination :
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- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (783)
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- Pitch - Mating :
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- Number of Positions or Pins (Grid) :
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- 10 (2 x 5) (123)
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- 28 (2 x 14), 16 Loaded (3)
- 3 (1 x 3) (1)
- 30 (2 x 15) (13)
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- 320 (19 x 19) (1)
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- Contact Material - Mating :
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- Applied Filters :
2494 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,828
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 3POS GOLD | 800 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 3 (1 x 3) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
|
|
VIEW |
2,031
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS TIN | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 14 (2 x 7) | Beryllium Copper | - | Copper | |||
|
|
VIEW |
668
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,124
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 18POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
720
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,283
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,944
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,476
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
2,509
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,743
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,989
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,066
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,497
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,742
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,833
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,306
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
2,309
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,572
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
3,347
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,221
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,950
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,480
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,564
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,911
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,155
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,850
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,851
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,465
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 18POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,871
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
