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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
GLOBAL STOCKS
	36-6553-18	RFQ VIEW	PDF RFQ	1,612 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-3554-10	RFQ VIEW	PDF RFQ	3,426 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6554-10	RFQ VIEW	PDF RFQ	1,088 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6552-10	RFQ VIEW	PDF RFQ	2,243 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6551-10	RFQ VIEW	PDF RFQ	2,182 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-3553-10	RFQ VIEW	PDF RFQ	864 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-3552-10	RFQ VIEW	PDF RFQ	3,502 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-3551-10	RFQ VIEW	PDF RFQ	952 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN		55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper

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