Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
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1,295
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRL Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm)
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1,934
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRL Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm)