Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,873
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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1,845
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,214
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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812
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,532
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,020
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,134
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,038
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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676
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,137
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,791
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,607
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
16-0518-00
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2,964
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Aries Electronics CONN SOCKET SIP 16POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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830
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass