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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	12-3513-10	RFQ VIEW	PDF RFQ	2,364 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-3513-10T	RFQ VIEW	PDF RFQ	3,049 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-1518-10H	RFQ VIEW	PDF RFQ	2,646 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-3513-10H	RFQ VIEW	PDF RFQ	3,911 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-4513-10	RFQ VIEW	PDF RFQ	2,016 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-6513-10H	RFQ VIEW	PDF RFQ	3,005 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-6513-10T	RFQ VIEW	PDF RFQ	715 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-6513-10	RFQ VIEW	PDF RFQ	3,779 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-1518-00	RFQ VIEW	PDF RFQ	1,082 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-1518-10T	RFQ VIEW	PDF RFQ	2,831 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass
	12-1518-10	RFQ VIEW	PDF RFQ	2,700 In-stock	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	12 (2 x 6)	Beryllium Copper	200.0µin (5.08µm)	Brass

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