- Series :
- Features :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (7)
- 12 (2 x 6) (4)
- 14 (2 x 7) (4)
- 16 (2 x 8) (4)
- 18 (2 x 9) (4)
- 2 (1 x 2) (5)
- 20 (2 x 10) (4)
- 22 (2 x 11) (4)
- 24 (2 x 12) (4)
- 26 (2 x 13) (4)
- 28 (2 x 14) (4)
- 30 (2 x 15) (4)
- 32 (2 x 16) (4)
- 34 (2 x 17) (4)
- 36 (2 x 18) (4)
- 38 (2 x 19) (4)
- 4 (2 x 2) (4)
- 40 (2 x 20) (4)
- 42 (2 x 21) (1)
- 44 (2 x 22) (2)
- 58 (2 x 29) (1)
- 6 (2 x 3) (7)
- 8 (2 x 4) (7)
- Applied Filters :
94 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,597
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,802
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,056
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,593
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,953
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,634
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,444
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,680
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
643
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,194
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,750
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,847
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,495
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 58POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 58 (2 x 29) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,039
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,030
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,548
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
875
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,646
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,222
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,954
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,593
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
891
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,048
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,427
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,448
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,338
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
930
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,969
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,384
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,624
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
