Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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RFQ
1,930
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 50.0µin (1.27µm) 14 (2 x 7) Phosphor Bronze
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RFQ
3,806
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 50.0µin (1.27µm) 14 (2 x 7) Phosphor Bronze
14-810-90R
RFQ
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RFQ
1,828
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 50.0µin (1.27µm) 14 (2 x 7) Phosphor Bronze