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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
GLOBAL STOCKS
	14-822-90E	RFQ VIEW	PDF RFQ	1,930 In-stock	Aries Electronics	CONN IC DIP SOCKET 14POS TIN		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	14 (2 x 7)	Phosphor Bronze
	18-822-90EWR	RFQ VIEW	PDF RFQ	3,982 In-stock	Aries Electronics	CONN IC DIP SOCKET 18POS TIN		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	18 (2 x 9)	Phosphor Bronze
	18-822-90E	RFQ VIEW	PDF RFQ	3,166 In-stock	Aries Electronics	CONN IC DIP SOCKET 18POS TIN		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	18 (2 x 9)	Phosphor Bronze
	08-822-90E	RFQ VIEW	PDF RFQ	1,747 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS TIN		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	8 (2 x 4)	Phosphor Bronze
	20-822-90E	RFQ VIEW	PDF RFQ	1,100 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS TIN		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	20 (2 x 10)	Phosphor Bronze

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