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- Series :
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- - (6855)
- 0503 (96)
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- 55 (253)
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- Termination :
- Features :
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- Type :
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- Housing (1)
- PGA (757)
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- Zig-Zag, Left Stackable (10)
- Zig-Zag, Right Stackable (9)
- Housing Material :
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- Liquid Crystal Polymer (LCP) (18)
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- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
-
- 100.0µin (2.54µm) (76)
- 12.0µin (0.30µm) (2)
- 135.0µin (3.43µm) (4)
- 15.0µin (0.38µm) (14)
- 150.0µin (3.81µm) (11)
- 20.0µin (0.51µm) (44)
- 25.0µin (0.63µm) (141)
- 250.0µin (6.35µm) (4)
- 29.5µin (0.75µm) (1214)
- 30.0µin (0.76µm) (2605)
- 35.4µin (0.90µm) (23)
- 5.00µin (0.127µm) (17)
- 50.0µin (1.27µm) (498)
- 60.0µin (1.52µm) (100)
- 78.7µin (2.00µm) (14)
- Flash (1406)
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (11)
- 10 (1 x 10) (58)
- 10 (2 x 5) (339)
- 10 (2 x 5), 6 Loaded (3)
- 10 (2 x 5), 8 Loaded (3)
- 100 (10 x 10) (5)
- 100 (11 x 11) (2)
- 100 (13 x 13) (10)
- 100 (15 x 15) (6)
- 101 (11 x 11) (2)
- 101 (13 x 13) (6)
- 101 (15 x 15) (2)
- 107 (12 x 12) (2)
- 108 (12 x 12) (2)
- 109 (12 x 12) (2)
- 11 (1 x 11) (33)
- 114 (13 x 13) (10)
- 12 (1 x 12) (43)
- 12 (2 x 6) (126)
- 12 (2 x 6), 6 Loaded (2)
- 12 (5 x 5) (2)
- 120 (13 x 13) (6)
- 121 (11 x 11) (3)
- 121 (13 x 13) (10)
- 121 (15 x 15) (4)
- 124 (13 x 13) (9)
- 125 (13 x 13) (2)
- 127 (16 x 16) (2)
- 128 (13 x 13) (9)
- 13 (1 x 13) (34)
- 132 (13 x 13) (12)
- 132 (14 x 14) (12)
- 133 (13 x 13) (8)
- 133 (14 x 14) (7)
- 135 (14 x 14) (2)
- 136 (14 x 14) (2)
- 14 (1 x 14) (40)
- 14 (2 x 7) (413)
- 14 (2 x 7), 4 Loaded (3)
- 14 (2 x 7), 8 Loaded (5)
- 142 (15 x 15) (2)
- 143 (15 x 15) (2)
- 144 (12 x 12) (6)
- 144 (13 x 13) (4)
- 144 (15 x 15) (9)
- 145 (13 x 13) (2)
- 145 (15 x 15) (14)
- 145 (17 x 17) (2)
- 146 (15 x 15) (2)
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- 149 (15 x 15) (12)
- 15 (1 x 15) (40)
- 153 (15 x 15) (2)
- 155 (16 x 16) (4)
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- 156 (16 x 16) (4)
- 159 (16 x 16) (2)
- 16 (1 x 16) (41)
- 16 (2 x 8) (393)
- 16 (2 x 8), 4 Loaded (3)
- 16 (2 x 8), 8 Loaded (8)
- 160 (13 x 13) (2)
- 160 (14 x 14) (2)
- 160 (15 x 15) (3)
- 160 (16 x 16) (2)
- 161 (14 x 14) (2)
- 168 (17 x 17) (10)
- 169 (13 x 13) (3)
- 169 (17 x 17) (6)
- 17 (1 x 17) (38)
- 172 (16 x 16) (2)
- 174 (17 x 17) (4)
- 175 (14 x 14) (2)
- 175 (15 x 15) (2)
- 175 (16 x 16) (11)
- 176 (15 x 15) (2)
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- 177 (15 x 15) (2)
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- 279 (19 x 19) (6)
- 28 (1 x 28) (25)
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- 28 (2 x 14), 14 Loaded (3)
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- 28 (4 x 7) (1)
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- 280 (19 x 19) (2)
- 281 (19 x 19) (6)
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- 4 (1 x 4) (57)
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- 42 (2 x 21) (173)
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- 48 (2 x 24) (221)
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- 8 (2 x 4) (351)
- 8 (2 x 4), 4 Loaded (1)
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- 97 (14 x 14) (2)
- Contact Material - Mating :
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- Applied Filters :
8867 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,773
In-stock
|
Preci-Dip | CONN SOCKET PGA 281POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 281 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,631
In-stock
|
Preci-Dip | CONN SOCKET PGA 281POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 281 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,782
In-stock
|
Preci-Dip | CONN SOCKET PGA 279POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 279 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,999
In-stock
|
Preci-Dip | CONN SOCKET PGA 279POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 279 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,699
In-stock
|
Aries Electronics | CONN SOCKET PLCC ZIF 84POS GOLD | 537 | Active | - | - | - | - | Closed Frame | PLCC, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 12.0µin (0.30µm) | - | 84 (4 x 21) | - | - | - | |||
|
|
VIEW |
2,133
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,454
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,350
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
773
In-stock
|
Preci-Dip | CONN SOCKET BGA 652POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 652 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,451
In-stock
|
Preci-Dip | CONN SOCKET BGA 600POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 600 (35 x 35) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,274
In-stock
|
Preci-Dip | CONN SOCKET BGA 576POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 576 (30 x 30) | Beryllium Copper | - | Brass | |||
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VIEW |
3,210
In-stock
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Preci-Dip | CONN SOCKET BGA 560POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 560 (33 x 33) | Beryllium Copper | - | Brass | |||
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VIEW |
3,062
In-stock
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Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
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VIEW |
2,801
In-stock
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Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
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VIEW |
633
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,784
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,416
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,639
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,481
In-stock
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Preci-Dip | CONN SOCKET BGA 652POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 652 (35 x 35) | Beryllium Copper | - | Brass | |||
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VIEW |
1,998
In-stock
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Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
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|
VIEW |
2,914
In-stock
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Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
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VIEW |
1,420
In-stock
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Preci-Dip | CONN SOCKET BGA 520POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 520 (31 x 31) | Beryllium Copper | - | Brass | |||
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VIEW |
3,828
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 3POS GOLD | 800 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 3 (1 x 3) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
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VIEW |
1,686
In-stock
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Preci-Dip | CONN SOCKET BGA 504POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 504 (29 x 29) | Beryllium Copper | - | Brass | |||
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VIEW |
2,727
In-stock
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Preci-Dip | CONN SOCKET BGA 500POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 500 (30 x 30) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,002
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
