Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
317-93-121-41-005000
RFQ
VIEW
RFQ
3,676
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 21POS GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 21 (1 x 21) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
228-1290-00-0602J
RFQ
VIEW
RFQ
2,844
In-stock
3M CONN IC DIP SOCKET ZIF 28POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
317-43-116-41-005000
RFQ
VIEW
RFQ
880
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET 16POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
317-43-121-41-005000
RFQ
VIEW
RFQ
3,034
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET 21POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
242-1293-00-0602J
RFQ
VIEW
RFQ
2,835
In-stock
3M CONN IC DIP SOCKET ZIF 42POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
232-1291-00-0602J
RFQ
VIEW
RFQ
2,038
In-stock
3M CONN IC DIP SOCKET ZIF 32POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
256-1292-00-0602J
RFQ
VIEW
RFQ
2,748
In-stock
3M CONN IC DIP SOCKET ZIF 56POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 56 (2 x 28) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
290-1294-00-3302J
RFQ
VIEW
RFQ
2,597
In-stock
3M CONN IC DIP SOCKET ZIF 90POS GLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 90 (2 x 45) Beryllium Copper 0.070" (1.78mm) 30.0µin (0.76µm) Beryllium Copper
317-43-108-41-005000
RFQ
VIEW
RFQ
2,771
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET 8POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
264-1300-00-0602J
RFQ
VIEW
RFQ
2,797
In-stock
3M CONN IC DIP SOCKET ZIF 64POS GLD Textool™ Active Bulk -55°C ~ 125°C Connector Press-Fit Closed Frame DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Polysulfone (PSU), Glass Filled 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) 30.0µin (0.76µm) Beryllium Copper