Contact Finish - Post :
Number of Positions or Pins (Grid) :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
299-43-640-10-002000
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1,165
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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875
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 145POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 145 (15 x 15) Beryllium Copper - Brass Alloy
510-93-145-15-081001
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VIEW
RFQ
651
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 145POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 145 (15 x 15) Beryllium Copper - Brass Alloy
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713
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 175POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 175 (16 x 16) Beryllium Copper - Brass Alloy
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1,373
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 241POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 241 (18 x 18) Beryllium Copper - Brass Alloy
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RFQ
3,826
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
415-13-272-41-003000
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3,288
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 72POS GOLD 415 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 72 (2 x 36) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-652-41-001000
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3,126
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 52 (2 x 26) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,685
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,097
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,973
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
110-13-648-41-001000
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RFQ
1,938
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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VIEW
RFQ
1,309
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
810
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,755
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
1,805
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
2,898
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,425
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
1,742
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
2,382
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
2,722
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,516
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
3,618
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
1,316
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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VIEW
RFQ
3,102
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-964-41-105000
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VIEW
RFQ
1,575
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,348
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 326 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-952-41-001000
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VIEW
RFQ
1,903
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 52 (2 x 26) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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734
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,670
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy