Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	10-810-90C	RFQ VIEW	PDF RFQ	2,235 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Vertical	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-6810-90C	RFQ VIEW	PDF RFQ	3,208 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Vertical	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-4810-90C	RFQ VIEW	PDF RFQ	646 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Vertical	Solder	Closed Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-2810-90C	RFQ VIEW	PDF RFQ	3,709 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Vertical	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass

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