Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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668
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper - Brass
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3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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3,465
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TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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3,212
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 12POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Press-Fit Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 12 (2 x 6) Beryllium Copper - Brass
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1,308
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TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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3,483
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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2,211
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TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Active Tube - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 3.00µin (0.076µm) Beryllium Copper
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1,176
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,130
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
2-1571995-0
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RFQ
1,604
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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2,008
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
AR 18-HZW/TN
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2,519
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Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR20-HZL/07-TT-R
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RFQ
912
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,049
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 10 (2 x 5) Beryllium Copper - Brass
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1,489
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN - Active - -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
AR18-HZL/07-TT-R
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2,028
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,269
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
AR 40 HZW/TN
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3,202
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Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,373
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Active Bulk - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin-Lead 18 (2 x 9) Copper Alloy - Copper Alloy
AR 24 HZW/TN
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RFQ
2,120
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Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 28 HZL/01-TT
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2,676
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Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 24 HZL/01/7-TT
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1,163
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
1-1571994-0
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RFQ
1,957
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
AR 20-HZW/TN
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657
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Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 16 HZW/TN
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RFQ
2,433
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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849
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 47.2µin (1.20µm) Copper Alloy
1814640-8
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RFQ
729
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,886
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 12 (1 x 12) Beryllium Copper 20.0µin (0.51µm) Copper
AR 40 HZL/07-TT
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RFQ
2,538
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 08 HZL/07-TT
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RFQ
3,762
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper