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15 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,427
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,927
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (1 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,026
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
2,508
In-stock
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On Shore Technology Inc. | CONN SOCKET SIP 13POS GOLD | SBU | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 13 (1 x 13) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,459
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,585
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,584
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,586
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
676
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (1 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
975
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,850
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
2,873
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 26POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,959
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,487
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,627
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 3POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 3 (1 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
