- Packaging :
- Operating Temperature :
- Mounting Type :
- Termination :
- Housing Material :
-
- FR4 Epoxy Glass (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (568)
- Polybutylene Terephthalate (PBT) (11)
- Polybutylene Terephthalate (PBT), Glass Filled (11)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (24)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (38)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (28)
- Polyester (3)
- Polyester, Glass Filled (13)
- Thermoplastic (2)
- Thermoplastic, Polyester (13)
- Thermoplastic, Polyester, Glass Filled (2)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (6)
- 10 (1 x 10) (6)
- 10 (2 x 5) (8)
- 100 (15 x 15) (1)
- 11 (1 x 11) (6)
- 114 (13 x 13) (1)
- 12 (1 x 12) (6)
- 12 (2 x 6) (6)
- 121 (13 x 13) (1)
- 124 (13 x 13) (1)
- 13 (1 x 13) (6)
- 132 (13 x 13) (1)
- 132 (14 x 14) (1)
- 133 (14 x 14) (1)
- 14 (1 x 14) (5)
- 14 (2 x 7) (31)
- 144 (12 x 12) (1)
- 144 (15 x 15) (1)
- 145 (15 x 15) (1)
- 149 (15 x 15) (1)
- 15 (1 x 15) (6)
- 16 (1 x 16) (6)
- 16 (2 x 8) (28)
- 169 (17 x 17) (1)
- 17 (1 x 17) (6)
- 18 (1 x 18) (6)
- 18 (2 x 9) (24)
- 19 (1 x 19) (6)
- 191 (18 x 18) (1)
- 2 (1 x 2) (12)
- 20 (1 x 20) (6)
- 20 (2 x 10) (35)
- 209 (17 x 17) (1)
- 21 (1 x 21) (6)
- 22 (1 x 22) (6)
- 22 (2 x 11) (19)
- 225 (18 x 18) (1)
- 23 (1 x 23) (6)
- 24 (1 x 24) (6)
- 24 (2 x 12) (58)
- 241 (18 x 18) (2)
- 25 (1 x 25) (6)
- 26 (1 x 26) (6)
- 26 (2 x 13) (6)
- 27 (1 x 27) (6)
- 28 (1 x 28) (6)
- 28 (2 x 14) (46)
- 29 (1 x 29) (6)
- 296 (19 x 19) (1)
- 3 (1 x 3) (6)
- 30 (1 x 30) (6)
- 30 (2 x 15) (6)
- 31 (1 x 31) (6)
- 32 (1 x 32) (6)
- 32 (2 x 16) (32)
- 321 (19 x 19) (2)
- 33 (1 x 33) (6)
- 34 (1 x 34) (6)
- 34 (2 x 17) (6)
- 35 (1 x 35) (6)
- 36 (1 x 36) (6)
- 36 (2 x 18) (8)
- 361 (18 x 18) (1)
- 37 (1 x 37) (6)
- 37 (10 x 10) (1)
- 38 (1 x 38) (6)
- 38 (2 x 19) (6)
- 381 (18 x 18) (1)
- 39 (1 x 39) (6)
- 4 (1 x 4) (6)
- 4 (2 x 2) (7)
- 40 (1 x 40) (7)
- 40 (2 x 20) (28)
- 42 (2 x 21) (2)
- 44 (2 x 22) (2)
- 478 (26 x 26) (4)
- 48 (2 x 24) (12)
- 5 (1 x 5) (6)
- 50 (2 x 25) (9)
- 52 (2 x 26) (2)
- 56 (9 x 9) (1)
- 58 (2 x 29) (1)
- 6 (1 x 6) (6)
- 6 (2 x 3) (18)
- 64 (2 x 32) (10)
- 68 (10 x 10) (1)
- 68 (11 x 11) (2)
- 69 (11 x 11) (2)
- 7 (1 x 7) (6)
- 72 (11 x 11) (1)
- 8 (1 x 8) (6)
- 8 (2 x 4) (25)
- 84 (10 x 10) (1)
- 84 (13 x 13) (1)
- 9 (1 x 9) (6)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
717 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,522
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,232
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,692
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,145
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 381 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,190
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 225 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,170
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 241POS GOLD | PKA | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 241 (18 x 18) | Copper Alloy | 118.1µin (3.00µm) | Phosphor Bronze | ||||
VIEW |
642
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 361 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,130
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 145 (15 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,235
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 241 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
846
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 121 (13 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,963
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 149 (15 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,230
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,921
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,764
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 296 (19 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,465
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 321POS GOLD | - | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 321 (19 x 19) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
901
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,414
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 133 (14 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,160
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,974
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,477
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,124
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | ||||
VIEW |
1,308
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 321POS GOLD | - | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 321 (19 x 19) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
917
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 191 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,510
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,282
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,641
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,794
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,109
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,760
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 169 (17 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,824
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 52 (2 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |