Contact Finish - Post :
Number of Positions or Pins (Grid) :
Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,522
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Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Brass 10.0µin (0.25µm) Brass
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1,232
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
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3,692
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Brass 10.0µin (0.25µm) Brass
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1,145
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 381 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,190
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 225 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,170
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 241 (18 x 18) Copper Alloy 118.1µin (3.00µm) Phosphor Bronze
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642
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 361 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,130
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 145 (15 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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3,235
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 241 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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846
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 121 (13 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,963
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 149 (15 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
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2,230
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
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3,921
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,764
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 296 (19 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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3,465
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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901
In-stock
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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2,414
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 133 (14 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
110-91-950-41-001000
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1,160
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,974
In-stock
Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
110-91-432-41-001000
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1,477
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-11-624-41-001000
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1,124
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
1,308
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy - Copper Alloy
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VIEW
RFQ
917
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 191 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
110-91-624-41-001000
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RFQ
2,510
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-424-41-001000
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RFQ
1,282
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-324-41-001000
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RFQ
1,641
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,794
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
110-91-964-41-001000
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VIEW
RFQ
2,109
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,760
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 169 (17 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
110-91-952-41-001000
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1,824
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy