Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,828
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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1,119
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 36 (2 x 18) Beryllium Copper 25.0µin (0.63µm) Copper
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2,573
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 20 (2 x 10) Copper Alloy - -
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1,584
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 32 (2 x 16) Copper Alloy - -
832-AG11D
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2,025
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 32 (2 x 16) Copper Alloy - Copper Alloy
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2,566
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 28 (2 x 14) Beryllium Copper 25.0µin (0.63µm) Copper
848-AG11D-ES
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3,680
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 48 (2 x 24) Copper Alloy - Copper Alloy
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3,085
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 64 (2 x 32) Copper Alloy - -
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685
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 14 (2 x 7) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,747
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Copper
818-AG11D-ES
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3,939
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Copper Alloy - Copper Alloy
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3,021
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 28 (2 x 14) Copper Alloy - -
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948
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 20 (2 x 10) Copper Alloy 80.0µin (2.03µm) Copper Alloy
814-AG10D-ES
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1,783
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 14 (2 x 7) Beryllium Copper - Copper Alloy
824-AG11D
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2,478
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 24 (2 x 12) Copper Alloy - Copper Alloy
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2,117
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 7POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.75" (19.05mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 7 (1 x 7) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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2,766
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 40 (2 x 20) Copper Alloy - -
828-AG11D
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3,295
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 28 (2 x 14) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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809
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 32 (2 x 16) Copper Alloy - -
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2,040
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Copper Alloy - -
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2,447
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Copper
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1,944
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Copper
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3,294
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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3,690
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
824-AG11D-ES
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RFQ
3,455
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 24 (2 x 12) Copper Alloy - Copper Alloy
2-1437537-1
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1,614
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 14 (2 x 7) Copper Alloy - -
848-AG10D
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RFQ
2,533
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 48 (2 x 24) Copper Alloy - Copper Alloy
836-AG11D
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RFQ
3,892
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 36 (2 x 18) Copper Alloy - -
816-AG10D-ES
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910
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 16 (2 x 8) Beryllium Copper - Copper Alloy
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623
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 40 (2 x 20) Beryllium Copper 25.0µin (0.63µm) Copper