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- 124 (13 x 13) (7)
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- 136 (14 x 14) (2)
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- 142 (15 x 15) (2)
- 143 (15 x 15) (2)
- 144 (12 x 12) (2)
- 144 (13 x 13) (4)
- 144 (15 x 15) (7)
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- Contact Material - Mating :
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2966 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,828
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 3POS GOLD | 800 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 3 (1 x 3) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
|
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,294
In-stock
|
TE Connectivity AMP Connectors | CONN ZIGZAG 370POS GOLD | PKA | Active | Tube | - | Through Hole | Solder | Open Frame | Zig-Zag | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 370 (19 x 19) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,651
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 132POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 132 (14 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
741
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,308
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,396
In-stock
|
Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 20.0µin (0.51µm) | Phosphor Bronze | |||
|
|
VIEW |
1,716
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 68POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 68 (11 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
3,190
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 225 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,170
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 241POS GOLD | PKA | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 241 (18 x 18) | Copper Alloy | 118.1µin (3.00µm) | Phosphor Bronze | |||
|
|
VIEW |
1,937
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
721
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,531
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,403
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,319
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
995
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,211
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
632
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,769
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,430
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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1,939
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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2,248
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
