Contact Finish - Mating :
Contact Finish Thickness - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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1,514
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper Brass
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1,495
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Samtec Inc. CONN IC DIP SOCKET 14POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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2,296
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper Brass
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RFQ
1,121
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper Brass
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RFQ
VIEW
RFQ
1,198
In-stock
Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper Brass