Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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805
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,840
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Aries Electronics CONN SOCKET SIP 11POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,512
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS - Active Bulk - - - - SIP - - - - - 11 (1 x 11) - - -
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2,709
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Aries Electronics CONN SOCKET SIP 11POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,108
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Aries Electronics CONN SOCKET SIP 11POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,689
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,400
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,179
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Harwin Inc. CONN SOCKET SIP 11POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 11 (1 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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3,878
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Aries Electronics CONN SOCKET SIP 11POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,249
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Aries Electronics CONN SOCKET SIP 11POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,787
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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1,845
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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913
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Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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1,934
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Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-111-41-013000
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3,907
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 11POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,930
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,417
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-111-41-013000
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1,486
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 11POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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602
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,123
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Aries Electronics CONN SOCKET SIP 11POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 11 (1 x 11) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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2,848
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Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,378
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Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,523
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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3,636
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass