Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-119-41-013000
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2,616
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 19POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,078
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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601
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,278
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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1,791
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Harwin Inc. CONN SOCKET SIP 19POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 19 (1 x 19) Beryllium Copper 196.9µin (5.00µm) Brass
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3,621
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Aries Electronics CONN SOCKET SIP 19POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,277
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Aries Electronics CONN SOCKET SIP 19POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,178
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,812
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,987
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Aries Electronics CONN SOCKET SIP 19POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 19 (1 x 19) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,434
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,282
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass