- Packaging :
- Operating Temperature :
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (Round) (1)
- 1207 (33 x 34) (2)
- 14 (2 x 7) (9)
- 144 (12 x 12) (2)
- 16 (2 x 8) (5)
- 18 (2 x 9) (2)
- 20 (2 x 10) (2)
- 20 (4 x 5) (1)
- 24 (2 x 12) (7)
- 256 (16 x 16) (1)
- 28 (2 x 14) (6)
- 28 (4 x 7) (2)
- 3 (Round) (1)
- 32 (2 x 16) (6)
- 32 (2 x 7, 2 x 9) (3)
- 4 (Round) (1)
- 40 (2 x 20) (9)
- 400 (20 x 20) (3)
- 44 (4 x 11) (3)
- 52 (4 x 13) (3)
- 68 (4 x 17) (2)
- 8 (2 x 4) (3)
- 8 (Round) (2)
- 84 (4 x 21) (3)
- Contact Material - Post :
- Applied Filters :
79 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
955
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,842
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
812
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,719
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | 1207 (33 x 34) | Beryllium Copper | - | - | |||
|
|
VIEW |
2,617
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | 1207 (33 x 34) | Beryllium Copper | - | - | |||
|
|
VIEW |
3,221
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
894
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,875
In-stock
|
Preci-Dip | CONN SOCKET BGA 400POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 400 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,654
In-stock
|
Preci-Dip | CONN SOCKET PGA 256POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 256 (16 x 16) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
701
In-stock
|
Preci-Dip | CONN SOCKET BGA 400POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
888
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,586
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,904
In-stock
|
Mill-Max Manufacturing Corp. | CONN SKT PLCC | 940 | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | 68 (4 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
742
In-stock
|
Samtec Inc. | CONN SOCKET PLCC 44POS GOLD | PLCC | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Gold | Flash | 44 (4 x 11) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,841
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,131
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,959
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,041
In-stock
|
Samtec Inc. | CONN SOCKET PLCC 52POS TIN | PLCC | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Tin | - | 52 (4 x 13) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
797
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,240
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,352
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,684
In-stock
|
Preci-Dip | CONN SOCKET PGA 144POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 144 (12 x 12) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,368
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,681
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
669
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
720
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,214
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,838
In-stock
|
Samtec Inc. | CONN SOCKET PLCC 84POS TIN | PLCC | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Tin | - | 84 (4 x 21) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,713
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 84POS TIN | 940 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | 84 (4 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
