Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
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663
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Aries Electronics CONN IC DIP SOCKET 48POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze 200.0µin (5.08µm)
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1,696
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Phosphor Bronze 10.0µin (0.25µm)
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3,869
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Aries Electronics CONN IC DIP SOCKET 48POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze 200.0µin (5.08µm)
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3,161
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Phosphor Bronze 10.0µin (0.25µm)
4848-6000-CP
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988
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3M CONN IC DIP SOCKET 48POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 48 (2 x 24) Phosphor Bronze 35.0µin (0.90µm)
4848-6004-CP
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1,699
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3M CONN IC DIP SOCKET 48POS TIN 4800 Active Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 48 (2 x 24) Phosphor Bronze 35.0µin (0.90µm)
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3,078
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CNC Tech CONN IC DIP SOCKET 48POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 48 (2 x 24) Phosphor Bronze 60.0µin (1.52µm)
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3,055
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Aries Electronics CONN IC DIP SOCKET 48POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze 200.0µin (5.08µm)
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3,708
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) 48 (2 x 24) Phosphor Bronze 15.0µin (0.38µm)