Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 22POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,381
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Aries Electronics CONN SOCKET SIP 22POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (1 x 22) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,289
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Aries Electronics CONN SOCKET SIP 22POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (1 x 22) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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728
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Aries Electronics CONN SOCKET SIP 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 22 (1 x 22) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
714-43-122-31-018000
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3,315
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 22POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (1 x 22) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,852
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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2,664
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,592
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
643654-1
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2,339
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TE Connectivity AMP Connectors CONN SOCKET SIP 22POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 22 (1 x 22) Beryllium Copper - Beryllium Copper
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1,523
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,699
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,961
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,930
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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2,081
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Harwin Inc. CONN SOCKET SIP 22POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 22 (1 x 22) Beryllium Copper 196.9µin (5.00µm) Brass
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3,051
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,181
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,290
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,500
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,218
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass