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60 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
50-9518-10E
RFQ
VIEW
RFQ
901
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
50-9513-10H
RFQ
VIEW
RFQ
2,500
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
116-83-650-41-011101
116-83-650-41-011101
RFQ
VIEW
RFQ
3,490
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
116-83-650-41-001101
116-83-650-41-001101
RFQ
VIEW
RFQ
3,523
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
50-9513-10T
RFQ
VIEW
RFQ
2,682
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
116-87-650-41-009101
116-87-650-41-009101
RFQ
VIEW
RFQ
1,311
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-83-650-41-003101
116-83-650-41-003101
RFQ
VIEW
RFQ
1,766
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-008101
116-87-650-41-008101
RFQ
VIEW
RFQ
2,487
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
614-83-950-31-012101
RFQ
VIEW
RFQ
1,744
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
614-83-650-31-012101
RFQ
VIEW
RFQ
1,252
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-002101
116-87-650-41-002101
RFQ
VIEW
RFQ
2,563
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-006101
116-87-650-41-006101
RFQ
VIEW
RFQ
1,476
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
612-87-950-41-001101
RFQ
VIEW
RFQ
1,167
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
612-87-650-41-001101
612-87-650-41-001101
RFQ
VIEW
RFQ
1,497
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
50-9518-10M
RFQ
VIEW
RFQ
1,905
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
614-87-950-41-001101
RFQ
VIEW
RFQ
682
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
614-87-650-41-001101
RFQ
VIEW
RFQ
3,513
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-013101
116-87-650-41-013101
RFQ
VIEW
RFQ
2,549
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
110-87-650-41-001101
110-87-650-41-001101
RFQ
VIEW
RFQ
3,113
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
50-9513-10
RFQ
VIEW
RFQ
2,447
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
116-83-650-41-007101
116-83-650-41-007101
RFQ
VIEW
RFQ
3,870
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
116-83-650-41-012101
116-83-650-41-012101
RFQ
VIEW
RFQ
3,408
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-001101
116-87-650-41-001101
RFQ
VIEW
RFQ
1,497
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-83-650-41-004101
116-83-650-41-004101
RFQ
VIEW
RFQ
3,670
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
50-9518-10
50-9518-10
RFQ
VIEW
RFQ
2,545
In-stock
 Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
115-83-650-41-003101
115-83-650-41-003101
RFQ
VIEW
RFQ
3,736
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
614-87-950-31-012101
RFQ
VIEW
RFQ
2,823
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
Default Photo
614-87-650-31-012101
RFQ
VIEW
RFQ
2,415
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-87-650-41-018101
116-87-650-41-018101
RFQ
VIEW
RFQ
1,256
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 50 (2 x 25) Beryllium Copper - Brass
116-83-650-41-008101
116-83-650-41-008101
RFQ
VIEW
RFQ
1,152
In-stock
 Preci-Dip CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 50 (2 x 25) Beryllium Copper - Brass
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