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- Operating Temperature :
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- Liquid Crystal Polymer (LCP) (1)
- Plastic (1)
- Polyamide (PA46), Nylon 4/6 (12)
- Polyamide (PA46), Nylon 4/6, Glass Filled (32)
- Polybutylene Terephthalate (PBT) (5)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (14)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (61)
- Polyester, Glass Filled (4)
- Thermoplastic, Glass Filled (4)
- Thermoplastic, Polyester (3)
- Thermoplastic, Polyester, Glass Filled (1)
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145 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
2,797
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,326
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
865
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,191
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,149
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,653
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,799
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,212
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,622
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,268
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,873
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,757
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
859
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,982
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | 18 (2 x 9) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
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|
VIEW |
1,461
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,731
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,331
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,736
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,319
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,790
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,821
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,331
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,405
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,738
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,229
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,028
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
891
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 18POS TIN | ICA | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,302
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,024
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
