Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
BU080Z-178-HT
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RFQ
1,446
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 8POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 8 (2 x 4) Beryllium Copper Brass
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RFQ
2,191
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper Beryllium Copper
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RFQ
3,652
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper Beryllium Copper
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RFQ
3,856
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper Brass
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RFQ
2,979
In-stock
CNC Tech CONN IC DIP SOCKET 8POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 8 (2 x 4) Phosphor Bronze Phosphor Bronze
245-08-1-03
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RFQ
2,741
In-stock
CNC Tech CONN IC DIP SOCKET 8POS TIN - Active Tube -40°C ~ 105°C Through Hole, Kinked Pin Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 8 (2 x 4) Phosphor Bronze Phosphor Bronze
243-08-1-03
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RFQ
1,916
In-stock
CNC Tech CONN IC DIP SOCKET 8POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 8 (2 x 4) Phosphor Bronze Phosphor Bronze
ED08DT
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RFQ
3,927
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 8POS TIN ED Active Tube -55°C ~ 110°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 8 (2 x 4) Phosphor Bronze Phosphor Bronze