- Series :
- Operating Temperature :
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- Features :
- Contact Finish Thickness - Mating :
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53 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,188
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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VIEW |
3,942
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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VIEW |
1,188
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | Flash | Brass | |||
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VIEW |
656
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 10POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,282
In-stock
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CNC Tech | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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VIEW |
1,286
In-stock
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CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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VIEW |
1,647
In-stock
|
CNC Tech | CONN IC DIP SOCKET 18POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
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VIEW |
1,806
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
3,457
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 20POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
3,338
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 16POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 16 (2 x 8) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
2,255
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 6POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 6 (2 x 3) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
3,850
In-stock
|
CNC Tech | CONN IC DIP SOCKET 18POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
3,537
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,529
In-stock
|
CNC Tech | CONN IC DIP SOCKET 14POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 14 (2 x 7) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
724
In-stock
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CNC Tech | CONN IC DIP SOCKET 6POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 6 (2 x 3) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,136
In-stock
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CNC Tech | CONN IC DIP SOCKET 18POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
3,986
In-stock
|
CNC Tech | CONN IC DIP SOCKET 14POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 14 (2 x 7) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,446
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 8POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
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|
VIEW |
2,631
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 14POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
671
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
2,191
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,020
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
2,561
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 18POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
862
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 14POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 14 (2 x 7) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
|
VIEW |
746
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 14POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 14 (2 x 7) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
2,402
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
2,636
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Beryllium Copper | |||
|
|
VIEW |
2,534
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Beryllium Copper | |||
|
|
VIEW |
1,456
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
1,085
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 14POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 14 (2 x 7) | Beryllium Copper | Flash | Beryllium Copper | |||
