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8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,264
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | |||
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VIEW |
3,863
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
2,585
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | |||
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VIEW |
1,932
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | |||
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VIEW |
1,586
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (1 x 20) | Beryllium Copper | |||
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VIEW |
2,561
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 18POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | |||
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VIEW |
2,301
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 40 (2 x 20) | Beryllium Copper | |||
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VIEW |
1,456
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (2 x 10) | Beryllium Copper | |||
