- Operating Temperature :
- Housing Material :
-
- FR4 Epoxy Glass (25)
- Liquid Crystal Polymer (LCP) (9)
- Plastic (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (23)
- Polyamide (PA9T), Nylon 9T, Glass Filled (7)
- Polybutylene Terephthalate (PBT), Glass Filled (27)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (39)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (4)
- Polyphenylene Sulfide (PPS) (35)
- Polyphenylene Sulfide (PPS), Glass Filled (5)
- Thermoplastic (10)
- Contact Finish - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (Round) (1)
- 1150 (2)
- 1151 (1)
- 1156 (34 x 34) (2)
- 1207 (33 x 34) (2)
- 14 (2 x 7) (9)
- 144 (12 x 12) (2)
- 16 (2 x 8) (5)
- 18 (2 x 9) (3)
- 192 (16 x 16) (1)
- 20 (2 x 10) (2)
- 20 (4 x 5) (10)
- 2011 (47 x 58) (1)
- 24 (2 x 12) (7)
- 255 (16 x 16) (1)
- 256 (16 x 16) (2)
- 256 (20 x 20) (1)
- 272 (20 x 20) (1)
- 28 (2 x 14) (7)
- 28 (4 x 7) (11)
- 292 (20 x 20) (1)
- 3 (Round) (1)
- 32 (2 x 16) (7)
- 32 (2 x 7, 2 x 9) (14)
- 32 (4 x 8) (4)
- 34 (2 x 8, 2 x 9) (1)
- 352 (26 x 26) (1)
- 356 (26 x 26) (1)
- 357 (19 x 19) (1)
- 360 (19 x 19) (1)
- 388 (26 x 26) (1)
- 4 (Round) (1)
- 40 (2 x 20) (9)
- 400 (20 x 20) (4)
- 420 (26 x 26) (1)
- 432 (31 x 31) (1)
- 44 (2 x 22) (1)
- 44 (4 x 11) (15)
- 456 (26 x 26) (1)
- 480 (29 x 29) (1)
- 500 (30 x 30) (1)
- 504 (29 x 29) (1)
- 52 (2 x 26) (1)
- 52 (4 x 13) (11)
- 520 (31 x 31) (1)
- 560 (33 x 33) (1)
- 576 (30 x 30) (1)
- 600 (35 x 35) (1)
- 652 (35 x 35) (1)
- 68 (2 x 34) (1)
- 68 (4 x 17) (11)
- 8 (2 x 4) (3)
- 8 (Round) (2)
- 84 (2x42) (1)
- 84 (4 x 21) (10)
- Contact Material - Mating :
- Pitch - Post :
- Contact Material - Post :
- Applied Filters :
185 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
689
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 652 (35 x 35) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,785
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 600 (35 x 35) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
800
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 576 (30 x 30) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,708
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 560 (33 x 33) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,819
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 500 (30 x 30) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,268
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 480 (29 x 29) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,266
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,974
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 504 (29 x 29) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,375
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 456 (26 x 26) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
896
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 432 (31 x 31) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,562
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 420 (26 x 26) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
955
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | Flash | Brass | |||
|
|
VIEW |
1,345
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 400 (20 x 20) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,847
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 388 (26 x 26) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,224
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 360 (19 x 19) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,191
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 357 (19 x 19) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,971
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 356 (26 x 26) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,875
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 352 (26 x 26) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,246
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 192 (16 x 16) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,842
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
812
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,719
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | 1207 (33 x 34) | Beryllium Copper | 0.043" (1.09mm) | - | - | |||
|
|
VIEW |
2,617
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | 1207 (33 x 34) | Beryllium Copper | 0.043" (1.09mm) | - | - | |||
|
|
VIEW |
3,221
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
894
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,875
In-stock
|
Preci-Dip | CONN SOCKET BGA 400POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 400 (20 x 20) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
|
|
VIEW |
1,498
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 292 (20 x 20) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,082
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 272 (20 x 20) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,654
In-stock
|
Preci-Dip | CONN SOCKET PGA 256POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 256 (16 x 16) | Beryllium Copper | 0.050" (1.27mm) | Flash | Brass | |||
|
|
VIEW |
3,964
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 256 (16 x 16) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
